Simply weeks after asserting the primary particulars of its upcoming Ryzen 7000 series desktop CPUs, AMD has disclosed a top level view of its shopper and server merchandise roadmap for the subsequent two generations. The information comes from AMD’s Monetary Analyst Day, throughout which CEO Dr. Lisa Su spoke concerning the firm’s plans to seize part of the projected $300 billion marketplace for high-performance computing options. Whereas the occasion is geared towards financial analysts and shareholders, disclosures about AMD’s aggressive positions in varied markets embody details about upcoming merchandise. The corporate additionally now has a brand new slogan: “Collectively we advance”.
Within the shopper market, AMD’s upcoming ‘Zen 4’ CPU core structure would be the foundation of the ‘Raphael’ technology of desktop CPUs, which can come to market because the Ryzen 7000 sequence earlier than the tip of this 12 months. This can be a high-end product line utilizing a 5nm manufacturing course of, and AMD guarantees an 8 – 10 p.c uplift in IPC (directions per clock) efficiency in addition to not less than a 25 p.c enchancment when it comes to efficiency per Watt. 4nm variations are additionally deliberate, although it is not clear what the segmentation can be.
Zen 4 may also energy the upcoming ‘Genoa’ line of Epyc server CPUs in addition to a brand new line of ‘Bergamo’ based mostly on a density-optimised variant referred to as Zen 4c for cloud-native computing functions. ‘Genoa-X’ variants will function AMD’s built-in 3D V-cache, a vertically stacked layer of high-speed reminiscence on prime of the CPU die. One other product line codenamed ‘Siena’ will goal a brand new market in clever edge and communications gear.
Following that, ‘Zen 5’ is a ground-up redesign deliberate for launch in 2024 and will additional enhance efficiency and effectivity in addition to introduce new optimisations for AI and machine studying for shopper Ryzen CPUs codenamed ‘Granite Ridge’. These CPUs will use 4nm and 3nm processes. The subsequent Epyc technology can be codenamed ‘Turin’ and needs to be launched in late 2024.
AMD additionally confirmed that its subsequent GPU microarchitecture, codenamed RDNA 3, will permit for a chiplet-based modular GPU design and can use a 5nm manufacturing course of. It is mentioned to ship a 50 p.c enchancment in efficiency per Watt. A 4th-gen Infinity Structure interconnect customary will permit AMD to combine third-party chiplets permitting for heterogenous platforms and elevated customisability for purchasers.
RDNA 3 can be seen in next-generation ‘Navi 3’ discrete GPUs, launching as the subsequent Radeon RX sequence of merchandise later this 12 months. This structure will build on RDNA 2, which has been utilized by a number of recreation console producers this technology, hinting that the subsequent technology will proceed to leverage AMD’s {hardware}. RDNA 3 may also be built-in into upcoming ‘Phoenix Level’ cell CPUs based mostly on the Zen 4 structure in 2023, with ‘Strix Level’ following in 2024.
For skilled markets, the CDNA 3 structure and XDNA, which is the results of AMD’s acquisition of Xilinx, will assist drive vital efficiency beneficial properties for brand new merchandise within the AI and high-performance compute house. New Intuition MI300 accelerators for AI coaching and Alevo sensible NICs for confidential computing are additionally anticipated so as to add to the corporate’s knowledge centre portfolio.
AMD sees progress in PC, console and cloud gaming in addition to interactive metaverse functions and 3D content material creation. Xilinx IP can be built-in throughout product traces to drive efficiency in AI inference and coaching workloads for customers and enterprises. The corporate can be engaged on a unified AI software program roadmap to make improvement extra cohesive throughout varied merchandise.
